Versatile Innovative Adhesive for Medical Implant

Bonding Dissimilar Substrates Using Novel Adhensive and Surface Treatment Methods

 

 

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Product(s) / TechnologyProduct(s) / Technologyhttps://silicones.elkem.com/EN/Our_offer/KEC/Pages/White-Papers/Versatile-Innovative-Adhesive-for-Medical-Implants.aspx2018-12-03T07:23:07Z

Introduction

The neuroengineering field is defined by the coupling of engineering and neuroscience; bringing together two different, but complimentary entities. Similarly, to create a successful neuroengineering device, it is necessary to couple the strengths of various, and sometimes distinctly different materials. Already, neurological devices have been successfully used to treat hearing loss, chronic pain, and epilepsy among other disorders.  As these devices advance, soon Parkinson’s disease, dementia, Alzheimer’s, obesity, and sleep apnea may be added to that list.  The realm of possibility for applying neuroengineering to medical devices is vast, but options for pairing the materials to make these advancements is more limited. 

 

Three hurdles that exist in selecting materials are creating a bond between substrates, developing a simple and feasible manufacturing process, and selecting materials that meet not only current regulatory guidelines, but follow regulatory trends for the future.  New adhesive technologies are an option to help overcome these hurdles by widening the range of material options to pursue new therapies.  Elkem Silicones seeks to create novel materials that can push the boundaries of existing devices and create new possibilities for the future.  This paper will explore the performance of a novel adhesive designed to meet evolving regulatory requirements, optimize production processes, and overcome the barriers of material selection by bonding with a variety of substrates for use in the field of neuroengineering.

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